VICE in practice — hardware product development
We design hardware that survives dust, heat, motion and handling. From enclosure to ASIC, every piece is co-designed with the AI that runs on it -- so the product is one system, not a stack of parts.
- Enclosure & mechanism design
- ASIC & SoC integration
- Thermal management
- Rapid prototyping
- DFM transfer
- EMI & vibration testing
- Precision manufacturing
- Yield optimization
- Field service design
// AltMatter research FAQ
How we build hardware that holds
01
Survey
Capture the environment -- thermal load, vibration profile, dust class, drop height. Write it down before the first sketch.
02
Integrate
Co-design enclosure, thermals and board layout so parts fit, cool and survive together -- not in isolation.
03
Validate
Thermal, vibration, EMI, drop and ingress testing in our Abuja lab. We break it before the field does.
04
Transfer
Yield-tested DFM documentation your contract manufacturer can actually use. No black-box tooling.
Frequently asked questions
AltMatter runs phased research programs: signal characterization first, then iterative hardware-software co-design, prototyping in our Abuja lab, and transfer to precision manufacturing.
Yes. Confidential builds run in isolated program tracks in our Abuja lab, under NDA from the first conversation, with IP assigned under your ownership framework.
NDAs by default. We can operate under your IP ownership framework from day one, with program documentation and artifacts assigned to you.
Signal studies run in weeks; full programs from bench prototype to manufacturing transfer typically span months. Scope sets the timeline — every program starts with a bounded signal study.
From first signal to shipped product, we move as one integrated team -- hardware, firmware, and AI in lockstep. No fragmentation, no handoffs that lose fidelity.
From first signal to shipped product, we move as one integrated team -- hardware, firmware, and AI in lockstep. No fragmentation, no handoffs that lose fidelity.
